| 摘要 |
A module (10) is described for use in data devices such as smart cards. The module (10) consists of a contact carrier (11) having contacts (12), an integrated circuit (13), and a base (20) enclosing the integrated circuit (13). The base (20) is formed to provide a groove (21) around the perimeter such that when the device is formed, material from an intermediate layer (32) will flow into the groove and secure the module (10) to the card. |
