| 摘要 |
PURPOSE:To avoid corrosion of a wiring and degradation of a bonding strength by a method wherein a bonding pad is covered with a bonding ball over its whole surface and the bonding ball is bonded to a dummy pattern. CONSTITUTION:The shape of a bonding pad 3 which is formed on the surface of a semiconductor chip 1 and is not covered with a protective film 4 is so formed as to have its outline inside the bonding surface of a bonding ball 6 which is provided at the lower end of a bonding wire 5 bonded to the upper surface of the bonding pad 3. Further, a dummy pattern 7 which can be jointed with the bonding ball 6 is provided around the bonding pad 3 so as to make the bonding ball 6 cover the whole surface of the bonding pad 3 and a part of the dummy pattern 7. With this constitution, the corrosion of a wiring 2 and the degradation of a bonding strength can be avoided. |
