| 摘要 |
A ceramic wiring substrate has a conductor layer on a ceramic substrate. The conductive layer is produced by sintering a paste comprising 85-97 wt.% W and 15-3 wt.% sintering additive. The sintering additive has a compsn. contg. (in wt.%) SiO2, Al2O3 and MgO on the ternary diagram surrounded by the points A(46,41,13), B(41,22.5,36.5), C(47,17,36), D(51,12,37), E(56,5,39), F(60,5,35), G(67,5,28), H(71,9,21), I(75,12,13), J(80,12,8), K(84,10,6), L(90,7.5,2.5), M(95,5,0) and N(80,16,4) and the inner points O(51,26,23), P(50.5,23,26.5), Q(55.5,18,26.5), R(63,15,22) and S(64,20,16). |
