| 摘要 |
<p>PURPOSE:To prevent the chip cracking at the time of a pickup and the breaking of an integrated circuit, etc., on a chip surface by using a pickup means supporting a chip from a side face and utilizing vacuum suction force for peeling an expansion tape in the periphery of the chip abutted against a suction stage. CONSTITUTION:A suction stage 2 is elevated, and the suction port 6 of the suction stage 2 is fast stuck to an expansion tape 46. A chip 41 is supported partially by a support section 7 by the adherence of the suction port 6, and the expansion tape 46 except a section where the support section 7 is abutted is sucked in the direction of suction paths 5 when vacuum suction is conducted under this state. Consequently, the expansion tape 46a in the periphery of the chip 41 is peeled from the chip 41. A picker 1 is lowered under the state in which an arm thereof is opened, and stopped at the side-face location of the chip 41. When a rotating driving means is deenergized under this state, the chip 41 is supported to the picker 1 by a spring. When the picker 1 is lifted under this state, an expansion tape 46a in the peripheral section of the chip 41 is peeled.</p> |
