| 摘要 |
<p>A method of manufacturing hermetically sealed circuit assemblies (10) having circuit elements (76) to be compression bonded is disclosed. Uniform thickness of individual hermetically sealed circuit assemblies is insured by positioning deformable spacer (124, 128) in the columns containing the circuit elements to be compression bonded, and deforming the deformable spacers so that a surface of each of the deformed spacers lies within a single plane. Thereafter a compressive force is applied to a stack of one or more circuits through the columns which contain the circuit elements to be compression bonded.</p> |
