发明名称 THICK-FILM HIGH FREQUENCY SIGNAL CIRCUIT APPARATUS WITH FEEDTHROUGH CAPACITOR
摘要 A thick-film high frequency signal circuit apparatus with a feedthrough capacitor. The apparatus includes a thick-film circuit (28a) in which a high frequency signal circuit is constituted on a substrate (33) in a thick-film configuration, a shielding case (27) for housing the thick-film circuit (28a) therein, a feedthrough capacitor (20a) constituted on one surface of the substrate (33) in the thick-film configuration and a terminal (50) for transmitting signals between the thick-film circuit (28a) and a circuit outside the shielding case (27), the terminal (50) having a first end (50a, 50b) coupled to the thick-film circuit (28a) through the feedthrough capacitor (20a) and a second end (50c) protruding outside the shielding case (27) through a hole (31) defined therein.
申请公布号 EP0315320(A3) 申请公布日期 1990.02.07
申请号 EP19880309154 申请日期 1988.10.03
申请人 KABUSHIKI KAISHA TOSHIBA;TOSHIBA AUDIO VIDEO ENGINEERING CO., LTD. 发明人 SEGAWA, MASAO C/O PATENT DIVISION;ARAKAWA, MASAYUKI C/O PATENT DIVISION
分类号 H01L23/66;H01L25/16;H05K1/03;H05K1/09;H05K1/16;H05K3/34;(IPC1-7):H01L23/56 主分类号 H01L23/66
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