发明名称 |
THICK-FILM HIGH FREQUENCY SIGNAL CIRCUIT APPARATUS WITH FEEDTHROUGH CAPACITOR |
摘要 |
A thick-film high frequency signal circuit apparatus with a feedthrough capacitor. The apparatus includes a thick-film circuit (28a) in which a high frequency signal circuit is constituted on a substrate (33) in a thick-film configuration, a shielding case (27) for housing the thick-film circuit (28a) therein, a feedthrough capacitor (20a) constituted on one surface of the substrate (33) in the thick-film configuration and a terminal (50) for transmitting signals between the thick-film circuit (28a) and a circuit outside the shielding case (27), the terminal (50) having a first end (50a, 50b) coupled to the thick-film circuit (28a) through the feedthrough capacitor (20a) and a second end (50c) protruding outside the shielding case (27) through a hole (31) defined therein. |
申请公布号 |
EP0315320(A3) |
申请公布日期 |
1990.02.07 |
申请号 |
EP19880309154 |
申请日期 |
1988.10.03 |
申请人 |
KABUSHIKI KAISHA TOSHIBA;TOSHIBA AUDIO VIDEO ENGINEERING CO., LTD. |
发明人 |
SEGAWA, MASAO C/O PATENT DIVISION;ARAKAWA, MASAYUKI C/O PATENT DIVISION |
分类号 |
H01L23/66;H01L25/16;H05K1/03;H05K1/09;H05K1/16;H05K3/34;(IPC1-7):H01L23/56 |
主分类号 |
H01L23/66 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|