| 摘要 |
<p>PURPOSE:To eleminate the necessity of an area required to mount a capacitor, to realize a compact device, and to reduce the number of components and processes by forming the capacitor between a lower section of an electronic component to be mounted and a circuit substrate. CONSTITUTION:A circuit substrate 4 is provided with a conductor wiring 3 which has an area corresponding to a projecting electrode 2 of a semiconductor element 1. One electrode 6 of a capacitor is provided to an opposite position on the circuit substrate 4 of the other electrode 5 of the capacitor which is provided to a lower section of the element 1. Then insulating resin 7 is applied to a mounting region of the element 1 on the substrate 4, and the element 1 is mounted on the substrate 4 through the resin 7. After the electrode 2 of the element 1 and the corresponding section of the wiring 3, and the both electrodes 5, 6 are registered, a pressure is applied to the element 1 against the substrate 4, and then the resin 7 is cured and the pressure is removed.</p> |
