| 摘要 |
<p>PURPOSE:To inexpensively form transparent electrodes without requiring a special aligner for forming the transparent electrodes as metallic wirings by selectively coating a metal on the patterned transparent electrodes, coating the surface of an electrode substrate with a negative type photoresist and stripping the photoresist, then etching away the exposed metal. CONSTITUTION:The patterned transparent electrodes 2 are formed on a glass substrate 1 and only the surface of the transparent electrodes is selectively coated with the metal 3 by chemical plating or electroplating. The surface of the transparent electrode substrate coated with the metal is coated with the negative type photoresist 4. The substrate is then irradiated with UV rays from the rear side of the substrate and the photoresist on the metal is stripped by development. The exposed metal is etched away and the remaining photoresist is completely stripped. The selective metallization of only the two side edges of the transparent electrodes is enabled in this way without requiring a special photomask.</p> |
