| 摘要 |
<p>PURPOSE: To reduce the peeling of a passivation glass layer from a metallic system, by providing the protective covering means of a metallization line, plural die corners and plural circuit zone corners wherefrom any circuit is excluded, and by providing the bonding means of a semiconductor die to a plastic sealing body. CONSTITUTION: An outside metallization line 28 separates an operating circuit zone 20 from a semiconductor die 14, and further, the semiconductor die 14 includes circuit zone corners 26 wherein any operating circuit is not present and any die corners 27 are not included, and so excludes the operating cicuits from the circuit zone corners 26 that the peelings of the layers of the corners 26 do not affect the operation of the semiconductor die 14. The operating circuit zone 20 is covered with a passivation glass 30 to notch one-portions of the glass 30. Also, it may occur that the layer of a plastic sealing body 16 is peeled from the semiconductor die 14 due to the difference between their thermal expansion coefficients. Bonding selectively the semiconductor die 14 to the plastic sealing body 16, this relative motion between both can be reduced. No plastic sealing body 16 is disposed on the circuit zone corners 26 of the semiconductor die 14.</p> |
