发明名称 |
Connecting structure for electronic part and method of manufacturing the same |
摘要 |
Disclosed is a connecting structure for electrically connecting an electronic part such as an LSI chip to a substrate and a method of manufacturing the same. The present invention is suitable especially for electrical connection between a plurality of chips and a substrate which is required to have a function of absorbing a difference in thermal expansion in the horizontal direction and to deform in the vertical direction, and characterized in that a conductive flat spring having a height not more than the minimum length in the lateral direction is provided between the electronic part such as a chip and a wires substrate.
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申请公布号 |
US4893172(A) |
申请公布日期 |
1990.01.09 |
申请号 |
US19880143200 |
申请日期 |
1988.01.13 |
申请人 |
HITACHI, LTD. |
发明人 |
MATSUMOTO, KUNIO;OSHIMA, MUNEO;SAKAGUCHI, SUGURU |
分类号 |
H01L21/60;H01L23/48;H05K3/32;H05K3/34 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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