| 摘要 |
PURPOSE:To reduce the number of parts on a printed board, and hence miniaturize the board and reduce mounting cost by mounting semiconductor chips on the surface and back surface of a lead frame and connecting each semiconductor chip to the same or separate lead portion by a bonding wire. CONSTITUTION:The title package is constructed such that semiconductor chips 2, 3 are mounted on the surface or back surface of a lead frame 1, and connected to the same or separate lead portions 5 through bonding wires 4. For example, semiconductor chips B3 are mounted, respectively, and connected to different leads 5 through the bonding wires 4. The mounting and bonding operations to the lead frames are carried out independently on the surface side and the back surface. After the bonding process for the chip, the chip is surrounded by mold resin by an ordinary process.
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