| 摘要 |
PURPOSE:To provide a sub-mount of an electrode structure strong in adhesive strength to a semiconductor chip and strong in bonding strength by employing different electrode materials, one for a portion for mounting chip parts and the other for a section for connection to an external electrode. CONSTITUTION:Elements 3 to 8 formed on a surface of an insulator 2 are in electrical contact with chip parts on one ends thereof and serve as connection parts to an external terminal on the other ends thereof. Electrode materials 4-6 of said one ends are different from electrode materials 7, 8 of said the other ends. For example, SiO2 2 is formed on Si 1, and then Cr.Pt.Au 3 is formed on the same. Then, after Sn 4 is deposited, a shape inverted to the shape of the Sn 4 electrode is formed with use of a resist, and an AuSn alloy 5 and Au 6 are deposited and lifted off. Thereafter, Sn other than the remaining Au/Sn alloy 5 and the Au 6 electrode is removed by etching to form an electrode of a portion of placing the chip parts. Then Ti 7 and Au 8 are deposited and patterned to form a bonding pad electrode. |
