| 发明名称 |
METHOD FOR PLATING SURFACE OF SUBSTRATE |
| 摘要 |
<p>In an improved process for the wet-chemical deposition of firmly adhering metal deposits on substrate surfaces, the surfaces are treated with a primer before activation. The materials obtained by the process are outstandingly suitable for screening electromagnetic waves.</p> |
| 申请公布号 |
JPH01312080(A) |
申请公布日期 |
1989.12.15 |
| 申请号 |
JP19890101836 |
申请日期 |
1989.04.24 |
| 申请人 |
BAYER AG;MOBAY CORP |
发明人 |
KIRUKORU JIRINIAN;RAINHORUTO DEDERIKUSU;RUDORUFU MERUTEN;URURITSUHI FUON GITSUITSUKI;GERUHARUTOODEIITAA BORUFU;JIYON RUISU UIRIAMUSU |
| 分类号 |
C23C18/28;C23C18/20;C23C18/30;C23C18/40;H05K3/18;H05K3/38 |
主分类号 |
C23C18/28 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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