发明名称 WIRE BONDING METHOD
摘要 PURPOSE:To disperse load, to inhibit an impact and to prevent the breaking of an element electrode by previously flattening the nose of a spherical ball and thermocompression-bonding the nose of the ball with the element electrode. CONSTITUTION:A bonding tool 1 and a ball 3 are lowered simultaneously, and pushed onto an oxide film 6 once, and the nose of the ball 3 is flattened. The tool 1 is moved onto an element electrode 4. The ball 3 is thermocompression-bonded with the element, electrode 4. The tool 1 is shifted, and a small-gage wire 2 is connected completely. The state of a surface contact is brought when the tool 1 is brought down and the ball 3 is brought into contact with the electrode 21. Accordingly, load is dispersed, an impact is inhibited and the breaking of the electrode 4 is prevented.
申请公布号 JPH01282828(A) 申请公布日期 1989.11.14
申请号 JP19880113231 申请日期 1988.05.09
申请人 NEC YAMAGATA LTD 发明人 SHIDARA ATSUSHI
分类号 H01L21/603;B23K20/00;H01L21/60 主分类号 H01L21/603
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