| 摘要 |
<p>PURPOSE:To improve both inspection efficiency and accuracy, by putting a pattern that is different from the pattern inspected on the top of the pattern inspected and comparing the two superposed patterns with each other. CONSTITUTION:A reference pattern 2 having a pattern that is different from the pattern 1 inspected is formed on a semiconductor substrate and the pattern inspected is formed by putting it on the top of the above reference pattern. Thus superposed pattern 3 is compared with other superposed pattern which is formed on the same semiconductor substrate through a pattern inspection device by image recognition. This approach improves the superposing accuracy of the pattern by image recognition and serves the purpose of performing the relative inspection of patterns with high accuracy.</p> |
