| 摘要 |
<p>PURPOSE:To obtain an IC mounting device of low cost, high reliability, and high packaging density, by a method wherein, a plurality of IC chips divided into groups are mounted on an auxiliary substrate to form a plurality of chip units, the respective units are aligned on a circuit substrate, and the connection between unit connecting terminals and the connection to external terminals are performed by a wiring pattern on the substrate. CONSTITUTION:On a circuit substrate 1 forming a memory card 10, a cutout part 1a for containing a power source device, a memory mounting part 1b, and a decoder mounting part 1c are provided. On the memory mounting part 1b on the upper surface of the substrate 1, a bonding pattern P is formed positionally corresponding to respective unit connecting terminals (t) of aligned chip units B1, B2, B3, B4, and the common pattern P per unit is commonly connected to an external connecting terminal T corresponding to the pattern P by a wiring pattern. On the decoder mounting part 1c, a decoder IC 2 is mounted with a pattern Ps. In this manner, an IC packaging density and a reliability are simultaneously enhanced with the decrease of a wiring and connecting densities on the substrate.</p> |
