| 摘要 |
PURPOSE:To obtain an inexpensive lead frame for a semiconductor by forming the lead frame of a material which contains not less than 90% of aluminum. CONSTITUTION:A material is composed, for example, of an alloy of aluminum (90%) and copper (10%). Since the lead frame of this composition contains a great deal of base metal (aluminum), the material cost is remarkably reduce with 13-22% of elongation rate, 130-155Hv of hardness, thereby providing material characteristics to satisfy the pressing accuracy. Since it has preferable bondability for a gold wire and an aluminum wire, it is not necessary to provided gold plating or silver plating as the practiced in the conventional one. |
