| 摘要 |
PURPOSE:To make it feasible to fix a strip material as it is closely adhered while assuring insulation from a chassis by a method wherein units comprising semiconductor device are stamped from one side to both sides of material by the first machine on the front step and then longitudinal grooves are stamped from the other side by the second machine on the rear step side. CONSTITUTION:An abnormal shaped strip material 12 fed from an uncoiler 11 intermittently at specified intervals is provided with a protrusion 13 formed on lower side extending in the longitudinal-direction on the central part with the height thereof regulated conforming to the material feeding port of the first machine 15 in case of passing through a leveler 14. Next the material 12 fed to the first machine 15 is stamped to produce the units required of high precision then the residual material 12 after stamping operation is conveyed by a conveyer 19 to specified position and after being reversed by a reversing roller (reverser) 20, further conveyed by another conveyer 21 to the second machine 22 for another stamping and bending operations. |
