SOLDERING METHOD OF ELECTRONIC PART,申请号JP19880007530-传众专利搜索

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发明名称	SOLDERING METHOD OF ELECTRONIC PART
摘要
申请公布号	JPH01183885(A)	申请公布日期	1989.07.21
申请号	JP19880007530	申请日期	1988.01.19
申请人	TOSHIBA CORP	发明人	HARA SATORU
分类号	B23K3/04;H05K3/34	主分类号	B23K3/04
代理机构		代理人
主权项
地址

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