发明名称 SEMICONDUCTOR INTEGRATED CIRCUIT
摘要 PURPOSE:To reduce the occupied area of a protecting element, and prevent leak current from increasing even at the time of high temperature, by forming, on a polycrystalline silicon layer, an aluminum wiring with a specific width via an insulating film, and using an air gap formed in a window part of the insulating film, as a protecting element for electrostatic breakdown. CONSTITUTION:The square of W being the wiring width of an aluminum wiring 8 on a boron and phosphorus doped glass layer(BPSG) film 6 is made more than or equal to 300times the area of a window 9 formed on the BPSG layer 6. As a result, by heat treatment to make an ohmic contact of the aluminum wiring, polycrystalline silicon is abnormally diffused in the aluminum wiring layer. Therefore, in the window 9 formed in the BPSG layer 6, the polycrystalline silicon vanishes as the result of reaction with aluminum, and an air gap 7 is formed between the aluminum wiring 8 and a polycrystalline silicon layer 5. The air gap is used as a protecting element for electrostatic breakdown, thereby reducing the occupied area of the protecting element, and preventing the increase of leak current even at the time of high temperature.
申请公布号 JPH01140655(A) 申请公布日期 1989.06.01
申请号 JP19870299103 申请日期 1987.11.26
申请人 NEC CORP 发明人 YAMAGISHI HIDETAKA
分类号 H01L23/52;H01L21/3205;H01L21/822;H01L23/60;H01L27/02;H01L27/04;H01L27/06;H01L29/41 主分类号 H01L23/52
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