发明名称 MULTILAYER INTERCONNECTION SUBSTRATE
摘要 PURPOSE:To make impedances of power-supply patterns almost zero and to inhibit the generation of unnecessary noise by a method wherein superconductors are used for the power-supply patterns. CONSTITUTION:A multilayer ceramic substrate main body 1 is provided with first, second and third power-supply layers 2, 3 and 4, wherein superconductors to be used as their internal layer patterns are used as their conductors. The signal conductors of the layers 2, 3 and 4 are connected to one another through a through via hole 5 for the signal conductors and a penetrating via hole 6 for the power supplies. The via hole 6 is connected with the power-supply patterns of the layers 2, 3 and 4. Thereby, the impedances of the power-supply patterns are made to be almost zero and the generation of unnecessary noise is inhibited.
申请公布号 JPH01137697(A) 申请公布日期 1989.05.30
申请号 JP19870296518 申请日期 1987.11.25
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 KAGEYAMA TEIJI;SAKASHITA SEIJI
分类号 H05K3/46 主分类号 H05K3/46
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