| 发明名称 |
SURFACE TREATMENT OF POLYIMIDE FOR IMPROVING ADHESIVENESS OF METAL BONDED TO SURFACE AND ARTICLE PRODUCED THEREBY |
| 摘要 |
<p>A method for treating a polyimide surface is disclosed, in which an adhesion-promoting compound such as thiourea contacts the surface prior to the electroless plating of metal thereon. Articles formed by such a method are also disclosed.</p> |
| 申请公布号 |
JPH01132772(A) |
申请公布日期 |
1989.05.25 |
| 申请号 |
JP19880241172 |
申请日期 |
1988.09.28 |
| 申请人 |
GENERAL ELECTRIC CO <GE> |
发明人 |
DONARUDO FURANKURIN FUOUSUTO;UIRIAMU BINSETSUTO DEYUMASU;EDOWAADO JIYON RAMUBII;BURATSUDOREI ROSU KARASU |
| 分类号 |
C23C18/40;C08J7/12;C09J5/02;C23C18/20;C23C18/26;H05K3/38 |
主分类号 |
C23C18/40 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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