| 摘要 |
<p>PURPOSE:To obtain the suction collet of a compound semiconductor element which is able to form the compound semiconductor element having a long lifetime and high reliability, by providing at a suction part a groove part having a width that is wider than that of an active region, thereby eliminating mechanical damage towards the active region. CONSTITUTION:The suction part 3 of a suction collet 1 is equipped with a groove part 11 having a width which is wider than that of an active region 5 of a semiconductor element 4. In the case of J/up assembly system where the active region 5 is incorporated so as to be separated from a submount 7, therefore, its system can be incorporated to keep away fully from the width of active region 5. In view of the result obtained empirically, the reliability of the semiconductor element 4 is affected significantly by mechanical damage which is about 50mum apart from the active region 5 but if the width L of the groove is prepared to have a distance 100mum, a satisfactory result is obtained in the field of long-term reliability. Further, it may be as well to have the rate of the width L that approximates 100-200mum.</p> |
