| 摘要 |
PROBLEM TO BE SOLVED: To provide a packaged micromirror assembly, having wafer area regions reduced per wafer structure. SOLUTION: This assembly has the micromirrors 70 formed of lower elements 60, having central mounting segments 63 enclosed by intermediate gimbals segments and frame segments 61. Magnet standoffs 68 are mounted at the central mounting segments 63, and upper mirror surfaces 65 are mounted at the magnet standoffs 68. The micromirrors 70 can be packaged into bodies having coil drivers. The magnetic fields generated by the coil drivers apply torques to the magnet standoffs 68, by which the magnet standoffs 68 are rotated. The upper mirrors 65 can rotate about the two axes for hinge of silicon in the lower elements 60.
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