发明名称 Wafer handling tool and method of use
摘要 An IC-wafer handling tool comprising an aluminum handle, a detachable polyimid pointed end member and a detachable polyimid hook end member. The pointed end is used in cooperation with a vacuum pick to load wafers into susceptor pockets, and the hooked end is used in cooperation with a vacuum pick to unload wafers. During loading and unloading, the only contact with the front side of the wafer is at the edge of the wafer, which does not contain integrated circuit structure, thereby decreasing particulate contamination of the wafer and the associated IC structure on the wafer.
申请公布号 US4823654(A) 申请公布日期 1989.04.25
申请号 US19880154166 申请日期 1988.02.08
申请人 APPLIED MATERIALS, INC. 发明人 MOORE, GARY M.
分类号 B25B9/00;B25B33/00;H01L21/683;(IPC1-7):B25B33/00;B25F1/00 主分类号 B25B9/00
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