发明名称 |
Semiconductor packages including thermal stress buffers and methods of manufacturing the same |
摘要 |
Provided is a semiconductor package and method of manufacturing the same. The semiconductor package may include a semiconductor chip, an encapsulant encapsulating the semiconductor chip, a lead unit, and a partially encapsulated by the encapsulating thermal stress buffer which absorbs thermal stress of the semiconductor chip or the encapsulant. |
申请公布号 |
US2008315379(A1) |
申请公布日期 |
2008.12.25 |
申请号 |
US20080213325 |
申请日期 |
2008.06.18 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
KIM KU-YOUNG;BAEK HYUNG-GIL;LEE JONG-GI;PARK SANG-WOOK;YEOM KUN-DAE;LEE DONG-HUN |
分类号 |
H01L23/495 |
主分类号 |
H01L23/495 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|