| 摘要 |
PURPOSE:To prevent a fixing part between a cooling pipe and an integrated circuit case from being detached due to a stress and to prevent an integrated circuit from being broken down by a method wherein the cooling pipe having an elastic thin-sheet metal on its rear surface and having a rigid thick-sheet metal on its surface, a spring used to press and hold the pipe on the integrated circuit case and a holding and fixing material are provided. CONSTITUTION:This structure is composed of the following: a metalmade cooling pipe which comes into contact with a heat-dissipating face 10 on the upper part of two or more integrated circuits on a printed-circuit board 1 and an integrated circuit case 2, which has a cooling medium path 7 in its inside, whose surface 5 is composed of a rigid thick-sheet metal and whose rear surface 6 is composed of an elastic thin- sheet metal; a spring 4 used to press this cooling pipe 3 in a direction of the printed circuit board 1; a holding and fixing material 8 of the spring 4. Because the surface 5 of the cooling pipe 3 is thick and rigid, it is pressed to the heat-dissipating face 10 nearly uniformly by using the spring 4. Because the rear surface 6 is composed of the elastic thin-sheet metal, it is closely contacted with the heat-dissipating face 10. Accordingly, even when the integrated circuit case 2 is tilted, a contact and cooling operation is executed sufficiently, and the semiconductors are not broken down due to a stress between the cooling pipe 3 and the case 2. |
