| 摘要 |
PURPOSE: To obtain a semiconductor chip carrier system that allows semiconductor chips to be connected to external circuits with reliability at various temperatures and under various stresses, by providing a housing, a plurality of semiconductor chips placed on a substrate and a plurality of flexible conductor devices containing cover plates and non-rigid and flexible portions extending inward and outward from the housing. CONSTITUTION: A chip carrier substrate 12 mounted with semiconductor chips 13 and conductors 31 is fixed in the recess 26 in a frame 15. At this time contact pads 32 are attached to the ends of the inner part 36b of leads 36 by soldering 59 or the like. Since the lead sections 36b are non-rigid and flexible, it is possible to connect them direct to the contact pads 32. Distortions produced by thermal expansion, thermal contraction and mechanical stress is absorbed by the lead sections 36b, and reliable connection is ensured. Then polydimethylsiloxyne, for example, is implanted in a chamber 18 to protect the substrate 12 and the semiconductor chips against environment. Subsequently, a cover 17 is installed in the recess 27 in the frame 15. |
