Single lead automatic clamping and bonding system

摘要

A system of single lead clamping and bonding in the assembly of integrated circuit devices. A capillary bonder has a clamp member (28) rotatably mounted around the capillary (26) for movement with the bond head. The clamp (28) is moveable vertically to contact and clamp a terminal to be bonded. The clamp (28) is rotatable to orient itself with respect to the terminal and the fine wire. The capillary (26) and clamp (28) move under computer control to make a series of bonds, typically between lead frame fingers and terminals on a semiconductor device.