ENCAPSULATED CHIP CAPACITOR

摘要

A chip capacitor consisting of a rectangular tantalum body (12) and an axial tantalum lead wire (14) extending from the front surface of the tantalum body (12), encapsulated by an insulating material (39) mold around said tantalum body (12) and covering all the surfaces (15, 17, 18, 21) thereof, except for a small region (9) of the bottom surface (19) wherein a metalzation (40) is provided, which covers a portion of the bottom surface (19) and adjacent rear surface (21) of the body (14) and forms a cathode contact.
The anode terminal (50) consists of a thin metal strip abutting the encapsulant (39) welded to the tantalum lead wire (14).