| 发明名称 |
BONDING OF POLYMER MATERIAL |
| 摘要 |
A method for improving the adhesion of a polymer such as an epoxy resin to an electrolytic copper surface wherein the copper surface to be adhered is exposed to gas plasma containing a fluorohydrocarbon. |
| 申请公布号 |
JPS6462454(A) |
申请公布日期 |
1989.03.08 |
| 申请号 |
JP19880148436 |
申请日期 |
1988.06.17 |
| 申请人 |
INTERNATL BUSINESS MACH CORP <IBM> |
发明人 |
SUJIYADEBUARA BUIJIYAYAKUMAA BABU;BU KUWANGU BUI;JIYOSEFU JIERAADO HOOFUAATO;JIYON ANDORIYUU UERUSHI |
| 分类号 |
B29C65/48;B32B15/08;C08J5/12;C09J5/02;C23C8/36;H05K3/38;H05K3/46 |
主分类号 |
B29C65/48 |
| 代理机构 |
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代理人 |
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