| 摘要 |
<p>PURPOSE:To perform good cutting without damaging a pellet, by dicing a semiconductive wafer along the scribing line of one main surface thereof to provide a cut groove and subsequently bonding an adhesive sheet to the main surface of the semiconductive wafer before grinding the other main surface of the semiconductive wafer to divide said wafer into semiconductive pellets. CONSTITUTION:The wafer 1 is diced along the scribing line of one main surface thereof before the grinding of the back surface of the wafer 1 is performed to provide a cut groove. Next, a surface adhesive sheet 2 is bonded to one main surface of the wafer to fix and hold said wafer 1 to the surface adhesive sheet 2. Subsequently, the other main surface (back surface) of the wafer 1 is ground so as to reach the cut groove provided by dicing to divide the wafer 1 into indivisual pellets 3.</p> |
