| 摘要 |
PURPOSE:To simplify an assembly facility, and to assemble the device without damaging characteristics and reliability by pasting and fixing a semiconductor wafer on adhesives applied and manufacturing a pellet through cutting and separation under a semirigid state. CONSTITUTION:A film 1 is turned over together with rings 2a, 2b and the surface of adhesives 3 is directed downward, and fitted into a recessed section formed at the central section of a vacuum pasting jig 4 through an O ring 5, and the semiconductor wafer 6 encased previously in the recessed section is attracted by air holes 4a by evacuating the inside of a space through a suction pipe 4b. The adhesives 3 and dried to a semirigid state, a set of the film 1 and the wafer 6 is turned over and returned to an orginal state, and fitted and fixed to the dicing stage 8b of a blade dicing device, a large number of the pellets 6a are manufactured through cutting, and each pellet 6a is picked up by the collet 12 of the vacuum adsorbing head section 9 of a die bonding device, and compression-bonded on a lead frame 11. |
