发明名称 LASER CUTTING METHOD
摘要 PURPOSE:To omit a post-treatment stage of removal of the oxidized film of a cut material and to reduce a product cost by incorporating a specific quality of H2 gas in assist gas. CONSTITUTION:Mixed gas in which 1-20% H2 is mixed in advance, or mixed gas 7 which is made at a processing head part 8 from H2 gas and inert gas sent separately is jetted to a work 3 through a collecting beam 1 and a nozzle 6. O2 component in the air which is sucked in under the nozzle 6 and H2 gas in the assist gas are reacted to reduce O2 and to prevent the working surface from being oxidized. As a result, when a work 3 after cutting is plated or welded, no peel of paint film and no blow hole in the bead occur. A high-quality product can be obtained.
申请公布号 JPS645692(A) 申请公布日期 1989.01.10
申请号 JP19870159337 申请日期 1987.06.26
申请人 MITSUBISHI ELECTRIC CORP 发明人 HIROSAKI TATSUYA;KANEOKA MASARU
分类号 B23K26/14;B23K26/00;B23K26/12;B23K26/38 主分类号 B23K26/14
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