| 摘要 |
PURPOSE:To execute a wire bonding operation of high reliability by forcibly sucking a space on the surface of a bonding stage. CONSTITUTION:When a lead frame 3 is situated over a bonding stage 4, a vacuum suction operation is started through suction ports 20a-20c; a space on the surface of the stage is sucked. By this setup, a foreign matter D existing on the stage is sucked and removed. Accordingly, it is possible to prevent a bonding point from being displaced due to the existence of the foreign matter D. If the suction operation is continued after that, it is possible to effectively prevent the bonding point from being dislocated. If the suction ports 20b, 20c are formed in positions where inner leads 8 on a stage face are mounted, it is possible to effectively prevent the displacement of the bonding point during a second bonding operation. By this setup, a stable bonding operation of a wire W can be executed. |
