发明名称 ELECTROLYTE SOLUTION AND PROCESS FOR GOLD ELECTROPLATING
摘要 <p>Gold plating baths comprising a nickel or cobalt brightener/hardener, containing a dicarboxylic acid having the formula HOOC-(CH2)n-COOH in which n is an integer from 1 to 4 or mixtures thereof, and acid selected from the group consisting of malic acid, gluconic acid and formic acid and mixtures thereof, plus optionally oxalic acid, enable the use of high current densities with attainment of improved efficiencies in producing bright deposits; also enable bright deposits to be obtained at high temperatures of about 150°F.</p>
申请公布号 WO1988009834(A1) 申请公布日期 1988.12.15
申请号 US1988001821 申请日期 1988.05.31
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