| 摘要 |
PURPOSE:To position immovable a semiconductor substrate to a contact board and to a flat-type vessel the semiconductor substrate is housed in for the protection of the semiconductor substrate against shocks that may be inflicted from outside by a method wherein the semiconductor substrate and the contact board are provided through-holes and the inner surfaces of both electrodes are provided with holes and one insulator-made rod is inserted through the through-holes into the holes in the electrode surfaces. CONSTITUTION:A semiconductor substrate 1 is housed in a flat-type vessel provided with electrodes 3 and 4 connected flexibly to an insulator-made side wall 6 built of insulating material. The semiconductor substrate 1 is caused to contact the inner surfaces of the electrodes 3 and 4, through the intermediary of a contact board 2 equipped with a thermal expansion coefficient similar to that of the semiconductor material employed, under pressure supplied from outside. The semiconductor substrate 1 and the contact board 2 are provided with through-holes 81 and 82, and the inner surfaces of the electrodes 3 and 4 with holes 83. An insulator-made rod 9 is allowed to go through the through-holes 81 and 82, to land into holes 83. In this way, the semiconductor substrate, the contact board, and the vessel may be fixed relative to each other in a lateral direction. There will be no contact between the substrate and the vessel in the presence of a shock supplied from outside, which prevents the device from degradation due to crack or break.
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