| 摘要 |
PURPOSE:To obtain a multilayer circuit substrate having excellent heat resistance and fire retardant property by containing in a resin layer fatty bromide and/or alicyclic bromide in polyimide resin and containing aromatic bromide. CONSTITUTION:Resin of a multilayer circuit substrate formed by integrally laminating a laminate in which an outer layer material is arranged through a resin layer on the upper and/or lower layers of an inner layer material contains in polyimide resin fatty bromide and/or alicyclic bromide, and also contains aromatic bromide. For example, two resin-impregnated base materials 2 obtained by impregnating a glass cloth having 0.1 mm of thickness with polyimide resin varnish made of polyimide, tetrabromethane, bromide diphenylether, N-methylpyrrolidone are arranged on the upper and lower surfaces of an inner layer material formed with circuits on both side surfaces of a both-side polyimide resin copper-extended circuit substrate, and copper foils having 0.035mm of thickness are arranged on the outside to prepare a laminate. The laminate is formed at 170 deg.C, and then aftercured at 200 deg.C to obtain a 4-layer circuit substrate. |
