| 摘要 |
PURPOSE:To prevent the phenomenon of the rising of one side of a mounting electronic part on soldering by applying a liquid having proper adhesion onto a section, on which cream solder is applied, before a substrate is heated in a reflow type furnace. CONSTITUTION:An adherent liquid 5 is applied onto the surface of a substrate 1 including a mounting electronic part 4 section temporarily fixed onto a conductor pattern 3 on the surface of the substrate 1 with cream solder and heated in a reflow type furnace, and the electronic part 4 is fastened onto the substrate 1 with solder. Accordingly, the other side is fixed temporarily by adhesion reinforced by the adherent liquid 5 and attraction is prevented even when one cream solder on the conductor pattern 3 is melted at speed faster than the other cream solder and intends to be attracted to one conductor pattern 3 side by surface tension at that time, instantaneously delaying other cream solder is also melted during that time, and the state of solder melting under the same conditions is brought and the electronic part 4 is fastened, thus inhibiting the generation of the so-called Manhattan phenomenon.
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