| 发明名称 |
Adhesively bonded photostructurable polyimide film |
| 摘要 |
Coated material containing in successive order (a) a substrate, (b) a photostructurable negative-working thermostable adhesive and (c) a self-supporting photocrosslinkable polyimide film. This arrangement can be used for producing relief images by means of photolithographic processes.
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| 申请公布号 |
US4786569(A) |
申请公布日期 |
1988.11.22 |
| 申请号 |
US19860901095 |
申请日期 |
1986.08.27 |
| 申请人 |
CIBA-GEIGY CORPORATION |
发明人 |
ROHDE, OTTMAR;SCHAFFNER, ARMIN |
| 分类号 |
G03F7/038;H05K1/00;H05K1/03;H05K3/34;H05K3/38;(IPC1-7):G03C5/16;G03C1/80;G03C1/84 |
主分类号 |
G03F7/038 |
| 代理机构 |
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