| 摘要 |
<p>Use of photosensitive compositions of matter for electroless deposition of metals The use of photosensitive compositions of matter for electroless deposition of metals, containing a) 0.1 to 20 per cent by weight of a compound of the formula I (I) in which Y and R1 to R6 are as defined in Patent Claim 1, b) 70 to 99.8% by weight of a polymer with H donor groups and an average molecular weight of at least 2,000 Daltons, or of a polymer mixture of a polymer component with H donor groups and an average molecular weight of at least 2,000 Daltons and a second polymer component with an average molecular weight of at least 3,000 Daltons, and c) 0.1 to 10% by weight of one or more salts of a metal of group Ib or YIII of the periodic table. Images, in particular electrically conductive coatings or patterns, can be produced with the above compositions of matter by exposing the compositions of matter to light and then depositing a metal on the zero-valent, non-conductive metal nuclei thereby formed.</p> |
