| 摘要 |
<p>PURPOSE:To enhance the reliability by a method wherein an external electrode formed collectively together with a sidewall resin molded object is extracted to the outside of a container near an insulating substrate at the lower part of a sidewall and near the surface of a resin at the upper part of the sidewall so that a soldering operation can be executed easily and that the soldered part cannot be melted again. CONSTITUTION:A semiconductor chip 6, lead wires 7, an insulating substrate 8 and end parts 4b of external electrodes protruding from a heat-radiating plate 1 on the bottom and from sidewall resin molded objects 2 are soldered collectively. A thermally sensitive circuit component 5 is soldered to edge parts 4a of the external electrodes protruding from the upper part of the sidewall resin molded objects 2. Because the edge parts are situated near the surface of a container, the soldering operation can be executed very easily and hardly influences the collectively soldered parts and a product of high reliability is obtained. If the external electrodes and the sidewall resin molded objects are formed collectively in this manner and identical electrode plates are constituted so as to protrude to the inside of the container at two different parts on sidewall resin faces, the soldering operation can be executed easily.</p> |
