| 摘要 |
PURPOSE:To shorten the process, by forming a dividing groove having a predetermined groove depth to one main surface of a substrate and applying plane polishing to one main surface from the back surface side thereof to the vicinity of the dividing groove to divide the substrate into a plurality of head chips. CONSTITUTION:A dividing groove 3 is formed to the main surface of a substrate 1 and heat generating resistors 2 are formed to the main surface having the dividing groove 3 formed thereto of the substrate 1 and conductor layers 5 are laminated and formed to the heat generating resistors 2 and, further, oxidation resistant layers 6 are formed on the conductor layers 5. Driving ICs 7 are mounted on the formed substrate 1 to arrange drive circuit parts. Next, an adhesive 8 is applied to the oxidation resistant layers 6 to bond radiation substrates 9. When the substrate 1 is polished from the back surface side 12 thereof, a plurality of thermal heads 4 are divided when polishing reaches the bottom part of the dividing groove 3, and cutting and polishing can be performed by one process and the process can be shortened. |
