发明名称 Solderable thermoplastic structure
摘要 A low cost thermoplastic material having a low heat distortion (HDT) thermoplastic material forms the main structural component of a structural member. A relatively high cost high HDT thermoplastic material is attached to the low cost main structural component and is plated with a solderable metallic coating. The coating can be attached to other structures with relatively higher temperature molten solder with negligible distortion. The structural member may be, for example, an electrical shield to be soldered to a printed circuit board or a printed circuit board whose core is low HDT material and exterior is high HDT material.
申请公布号 US4774126(A) 申请公布日期 1988.09.27
申请号 US19870075486 申请日期 1987.07.20
申请人 GENERAL ELECTRIC COMPANY 发明人 DORSEY, DENIS P.;RIZKOWSKI, STEPHEN
分类号 H05K1/03;H05K1/11;H05K3/34;H05K3/36;(IPC1-7):B32B3/00;B32B3/10 主分类号 H05K1/03
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