| 摘要 |
PURPOSE:To increase the measuring accuracy of a cross-sectional shape by enhancing the height measuring accuracy of a substrate, by extracting the height data only of the substrate part from a light cut image and a two-dimensional pattern and averaging the same to determine the height of the substrate part. CONSTITUTION:The two-dimensional pattern of an object 16 to be detected is taken in a microcomputer system 15 from a TV camera 14. Next, a substrate part 7 is extracted from the two-dimensional pattern to take in a light cut image from a TV camera 12 and the light cut line 6 corresponding to the sub strate part 7 is extracted from the light cut image and the two-dimensional pattern. Then, the sum of the height data extracted this time and the sum of the height data up to the previous time are added and the sampling number (n) of the data extracted this time are added to the sum of the sampling number (n) up to the previous time. The magnitude with an averaging sampling number n1 is investigated and, when the calculated sampling number is large, the aver age height of the substrate part 7 is calculated according to sum h/sum n. The height of a conductor pattern is measured on the basis of said average height.
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