| 摘要 |
PURPOSE:To secure the creamy solder for each part in proper amt. and to effect a reflow soldering of high reliability by forming a thinner plate thickness part by half-etching, printing a creamy solder by a flat squeegee and changing the plate thickness of a creamy solder printing board at the necessary part only. CONSTITUTION:The plate thickness of one part of a printing board 7 is thinned by half-etching to form a thin plate thickness part 4. As a result, the printing state becomes t1 at the part for plate thickness T1 and t2 at the part for plate thickness T2, so the plane area is not required to be reduced forcibly. No print- omission defective of the creamy solder is therefore caused, the height t2 is low at the fine pitch side and the deformation at preheating and reflowing times is reduced and the setting of the creamy solder amt. can easily be secured.
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