| 摘要 |
PURPOSE:To improve the strength of an IC chip and to contrive to shorten the production time of the chip by a method wherein a filler, which transmits ultraviolet light, is mixed into an ultraviolet curing resin and after the mixture is injected in a sealing part, ultraviolet light is irradiated to cure the resin. CONSTITUTION:An IC chip 2 is fixed in the IC burying part of a wiring board 1, the electrodes of the chip 2 are connected to the bonding terminals of the board 1 by leads and a sealing frame 3 is installed surrounding the burying part of the chip 2. After that, a mixture produced by mixing a transparent filler 11 into a sealing resin 4 consisting of an ultraviolet curing resin is potted in the IC burying part surrounded with the frame 3. Then, a mask having an opening part of a size nearly equal with the size of the opening part of the frame 3 is installed on a transparent member 12, ultraviolet light 5 is irradiated and the sealing resin 4 is cured.
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