| 摘要 |
PURPOSE:To surely produce the title formed article such as a circuit board at a low cost by roughing the surface of a primary formed article, applying a catalyst to the surface, covering the part except the part to be treated to obtain a secondary formed article, plating the surface, and then removing the covering material. CONSTITUTION:The board 1 (of a plastic, etc.), on which a projecting pattern 1a is formed, is formed as the primary formed article, a reducing agent such as stannous chloride is adsorbed on the formed article surface, and the article is dipped in a catalyst soln. contg. the noble metal ions of Pd, gold, etc., to deposit the noble metals on the formed article surface. The board 1 is then dried and set in a metallic mold, the mold is closed, the inside of the cavity is evacuated, then the covering material 2a (of a plastic, etc.) is charged to cover the part except the pattern 1a. The board 1 is degreased, electroless plating is carried out (about 20mu thickness) to plate only the pattern 1a, hence a conductive film layer 3a is formed, the covering plastic 2a is then released, and the board is cleaned and dried. By this method, the circuit board 3 can be surely produced at a low cost. |
