| 摘要 |
PURPOSE:To reduce the occurrence of cracks to a minimum by a method wherein a reinforcing material composed of a fiber-like material is included in a resin material at the lower part of a substrate-supporting part of a lead to which a semiconductor integrated circuit substrate is fixed. CONSTITUTION:A reinforcing material 14 composed of a fiber-like material is included in a resin material at the lower part of a substrate-supporting part 11 of a lead frame to which a semiconductor integrated circuit substrate 10 is fixed. The moisture in the air penetrates into the inside through penetrating openings 16, 17 and stays near the lower face of the substrate-supporting part 11. Even when the moisture is vaporized rapidly by a thermal stress caused during a soldering process to a printed-circuit board, only a small crack 18 is caused at a resin material 15 near the edge of the substrate-supporting part 11 thanks to the reinforcing material 14. As a result, it is possible to reduce the occurrence of the crack to a minimum.
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