| 摘要 |
PURPOSE:To remarkably decrease the number of resist grains adhering on the surface of a substrate to be treated by mounting a mechanism arranged around the substrate to be treated on the inside of a cup and preventing spattering-back in the direction of the substrate to be treated of a resist scattering into the cup with the revolution of the substrate to be treated. CONSTITUTION:A substrate to be treated 1 is sucked and held onto a base plate 2 by vacuum chuck, etc., and turned at approximately 6000rpm together with the base plate 2, and a resist is fed and applied onto the substrate surface to be treated 1 from a nozzle 4 for a resist supply mechanism 5. The resist is discharged from the inside of a cup 9 in displacement such as approximately 10mm H2O one by an exhaust mechanism 10 at that time. Resist grains scattered into the cup 9 with revolution in the direction of the arrow shown in the figure of the substrate to be treated 1 are moved so as to be directed toward the external direction between the inner wall of the cup 9 and a tabular fin 6c by an air current, etc., formed by the turn of the substrate to be treated 1 and the tabular fin 6c, and the greater part of the resist grains are discharged outside the cup 9 from an opening 8b for drain.
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